3D for automotive on show at Electronica
Visitors to the Toshiba stand in the Hall 6 automotive sector will have the opportunity to see the latest ‘Capricorn’ system-on-chip (SoC) solutions for driving and managing high-quality automotive displays; new ARM Cortex-M3 microcontroller technologies that address ISO26262 ASIL ( Automotive Safety Integrity Level) requirements for safety-critical systems; and automotive-qualified ASSP (application specific standard products) driver ICs that simplify the implementation of brushless DC (BLDC) motor control. The company will also be unveiling a new BiCDMOS semiconductor process platform for next-generation automotive ICs and showcasing automotive LEDs and power MOSFETs.
Capricorn display processors are highly integrated, scalable SoCs targeted at automotive digital instrument clusters and head up display (HUD) applications. Among the Capricorn SoCs on show at Electronica will be Capricorn-F, the first member of the family to provide support for 3D graphics and to incorporate APIX Gigabit digital serial data link transmission.
Designed to address the requirements of IEC61508 SIL3 and ISO26262 ASILD, Toshiba’s latest ARM Cortex-M3 32-bit microcontrollers incorporate Yogitech’s faultRobust technology. Compared to a conventional dual-core lockstep concept this reduces hardware and software overhead, while implementation of hardware diagnostic circuits with built-in self test allows transient and latent faults to be recognized. Using such a fault-tolerant MCU concept can also support development of fail-safe or fail-operational automotive systems. This technology will form the basis of Toshiba’s presentation for the Electronica Automotive Forum (Hall A6, stand 530) on 11th November at 15.00.
Among the ASSPs on show for the first time will be controller/pre-driver ICs optimised for driving the power stage of an automotive motor application while meeting the stringent requirements of the AEC-Q100 and TS16949 standards. These highly integrated devices will simplify and reduce the cost of implementing BLDC motors in applications such as fans, pumps and compressors.
For OEMs looking to develop their own ASICs Toshiba’s latest 130nm BiCDMOS process will permit unprecedented integration in robust, power efficient devices that need to provide reliable operation across the extended automotive temperature range.
- MCUs target automotive instrument clusters, shape head-up display projections
- Rugged Hall-sensor throttle position sensor, in distribution
- 4-channel data acquisition IC targets vehicle radar systems
- H.264 video I/O companion ICs for automotive MOST & ADAS
- Automotive circuit protection; high temperature, low leakage varistors
- Connected Car: Dramatic growth ahead
- Thermopile infrared array sensor tracks multiple objects
- 45W/channel audio PA for in-car systems with ‘light’ hybrid electrics
- Infineon takes the lead in auto semiconductors
- Cortex-M7 MCUs are structured for real-time tasks
- Automotive-grade buck regulator delivers 3A
- Switch targets automotive wireless over 50 to 3000 MHz
- Integrated, 2-channel, high-brightness automotive LED driver
- UMC to manufacture automotive power devices for Infineon
- BMW develops data goggles for drivers
- Is this the Tesla killer?
- Self-driving cars in real-world traffic with real customers
- Flow cell powertrain stuns with extreme data
- Audi launches lighting lab
- Supercapbatteries, thermoelectrics to power future cars
- Fuel cells in trucks: silent power instead of idling motors
- Rear axle becomes steerable… by wire
- Ballard IP to boost Audi’s fuel cell developments
- Infineon, Hella make radar sensor more affordable
- Porsche rainmaker advocates platooning
- Volvo cars share road-condition info in the cloud
- Scalable electric powertrain targets utility vehicles
- OLED exterior lighting soon in series vehicles, Osram says
- Driver chip reduces LED taillight complexity
- Xilinx flexes its muscles in the ADAS arena
- Making cars safer through technology innovation
- Supplying DC input power for HEV testing
- NSR Noise Suppressors: Wirewound Resistors
- Virtual Hardware “In-the-Loop”: Earlier Testing for Automotive Applications
- Open Standards and Product Differentiation
- Camera Solutions with Micrel Power Management and Networking