New Products
Fully integrated ultrasonic signal conditioner supports automotive parking distance applications
May 29, 2012 | Paul Buckley | 222902267
Texas Instruments Incorporated has introduced a fully integrated, programmable solution for driving ultrasonic transducers in automotive park distance, blind-spot detection or similar object detection applications.
With its highly configurable burst generator, low-noise amplifier and 12-bit successive-approximation-register (SAR) analog-to-digital converter (ADC), t he PGA450-Q1 provides for processing the echo signals and calculating the distance between the transducer and the object. Additionally, the PGA450-Q1 incorporates the physical layer for LIN 2.1 communications, giving flexibility in implementing any needed communication protocol.
The PGA450-Q1 displaces high-volume, discrete-based systems by offering the same functionality to any customer, economically as an ASSP, reducing design-cycles and non-recurring engineering costs, with no need for intellectual property or market agreements.
The fully integrated system-on-chip Includes all system blocks including regulators, dual NMOS low-side drivers, oscillator and a LIN 2.1 physical interface and protocol for interfacing to provide a cost- and space-optimized solution.
The device possesses highly configurable features, such as burst generator, low-noise amplifier, 12-bit SAR ADC, digital band-pass filter, and digital signal envelope detect, allowing for full configurability to the customer’s specific end application.
Availability and Pricing
The PGA450-Q1 comes in a TSSOP-28 package and is available now for ordering at a suggested retail price of $2.60 in 1,000-unit quantities.
The PGA450Q1EVM is available to speed the evaluation of the PGA450-Q1. Priced at $99.00, the evaluation module includes cables, graphical user interface, and example firmware to use with the included sensor.
More information about the PGA450-Q1 at
www.ti.com/pga450-q1-pr-eu
The PGA450-Q1 displaces high-volume, discrete-based systems by offering the same functionality to any customer, economically as an ASSP, reducing design-cycles and non-recurring engineering costs, with no need for intellectual property or market agreements.
The fully integrated system-on-chip Includes all system blocks including regulators, dual NMOS low-side drivers, oscillator and a LIN 2.1 physical interface and protocol for interfacing to provide a cost- and space-optimized solution.
The device possesses highly configurable features, such as burst generator, low-noise amplifier, 12-bit SAR ADC, digital band-pass filter, and digital signal envelope detect, allowing for full configurability to the customer’s specific end application.
Availability and Pricing
The PGA450-Q1 comes in a TSSOP-28 package and is available now for ordering at a suggested retail price of $2.60 in 1,000-unit quantities.
The PGA450Q1EVM is available to speed the evaluation of the PGA450-Q1. Priced at $99.00, the evaluation module includes cables, graphical user interface, and example firmware to use with the included sensor.
More information about the PGA450-Q1 at
www.ti.com/pga450-q1-pr-eu
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