eeTimes eeTimes EDN
Forgot password Register
Print - Send - -

New Products

Infineon rolls auto-qualified power MOSFETs in TO package

December 05, 2011 | Christoph Hammerschmidt | 222901948
Infineon rolls auto-qualified power MOSFETs in TO package Infineon Technologies has introduced automotive qualified lead-free power MOSFETs for TO package types. Based on the combination of innovative packaging technology and Infineon's thin wafer process technology, the new 40V OptiMOS T2 power MOSFETs offer best-in-class specifications.
Page 1 of 3

Infineon uses a diffusion soldering die attach approach to produce the lead-free packages that include TO-220, TO-262 and TO-263. Because of specific requirements in terms of package geometry, die pad thickness and chip size the diffusion soldering die attach approach is today only suitable for these three package types, and Infineon is able to supply them: OptiMOS T2 products in these packages are ready for production.

With the new MOSFET series, Infineon exceeds current RoHS (Restriction on Hazardous Substances) directives related to lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives pending implementation after 2014 may require 100 percent lead-free packaging. As the first MOSFETs in the industry to eliminate lead, the new Infineon devices allow customers to meet these stricter requirements.

The Infineon-patented lead-free die attach (the interconnection between chip and leadframe of the package) uses a diffusion soldering approach, which allows improved electrical and thermal performance, manufacturability and quality. Matching this die attach technology with Infineon's thin wafer processes (60µm compared to standard 175µm) enables several improvements for power semiconductors:

1 | 2 | 3 | Next page

Please login to post your comment - click here
Related News
Technical papers
Which approach is best suited for automotive infotainment connectivity?