New Melexis LIN Transceiver drives down cost
The LIN bus continues its successful adoption in automotive applications. This robust, cost effective communication scheme enables many basic networking functions in sub-systems previously considered to be uneconomical for smart sensors, actuators and controls. As a consequence of this successful implementation of many different LIN applications there is a need for LIN transceivers to manage the physical connection of the standard MCU to the LIN bus. Melexis new MLX80020BA easily meets the demand for LIN transceivers compliant to the LIN 2.x standard.
The MLX80020BA is a standalone LIN transceiver. Designed and fabricated in 0.35 micron HV-CMOS technology, the device enables customers to design LIN implementations at lower system costs. This transceiver has built in safety functions including TxD dominant time out as well as high impedance bus pin in case of loss of ground and under-voltage condition. The pin configuration of this new LIN transceiver is compatible to the defined standard pin out of the OEMs.
The EMC behavior of LIN Bus ICs is critical in automotive applications. The MLX80020BA design exhibits remarkable robustness when subjected to the injection of high frequency disturbances. The IC has also achieved very low electromagnetic emission to further simplify the design challenges of networked communication in hostile automotive environments. The timing parameters are optimized for the data transmission according LIN 2.x to obtain excellent EMC behavior.
The MLX80020BA meets the automotive temperature range of -40°C to 125°C and has on chip protection against over-temperature, 40V load dump and LIN short to ground resulting in a lower system component count and cost. The integrated standby management assures that the MLX80020BA can “wake up” from the LIN bus itself or directly from a connected microcontroller or an additional external source. Typical current consumption in sleep mode is lower than 9µA.
PPAP samples are available and come in a cost efficient SOIC8 RoHS compliant package.
For more information, visit http://www.melexis.com/In-Vehicle-Networking/General/MLX80020BA-772.aspx
- CAN FD transceiver family offers migration path from "old" CAN
- Thermocouple interface IC aimed at automotive powertrains
- Pressure sensors withstand harshest environmental conditions
- LF transmitter chip enables innovative start / immobiliser functions
- LIN device family cuts costs in in-vehicle networking
- All-in-one controller family to offer flexibility in driving small motors
- Image sensor targets driverless cars
- Programmable Hall sensor supports 2-wire operation
- Infrared sensor array sees a wider field of view, with low-noise imaging
- Wireless charging reference design targets smartphones in cars
- Pre-driver chip targets automotive high-current motor applications
- Time-of-flight sensor brings gesture recognition to car cockpit
- Stage win for ams against Melexis in patent claim
- Hall effect switch does away with mechanical adjustments
- Higher integration in LIN transceiver chips
- Auto chip market: upheaval ahead
- Delphi selected to build Audi’s autopilot computer
- MOST – a gigabit data backbone for future car generations?
- Is head-up display future ADAS screen?
- Automotive lighting design software models perception by human eye
- Automotive chip reliability: A matter of design methods
- How will deep learning change SoCs?
- Magneti Marelli revs up F1, motorcycle racing
- Study: Automotive industry leads digital revolution
- Multi-function integrated FET switch replaces automotive relays
- The car's the star...
- Fraunhofer launches test centre for high-voltage batteries
- MINI giving drivers a peek at 'augmented reality'
- MOSTCO demos integration of MOST bus with Autosar
- Rare earth magnets still optimum choice, says motor design expert
- Intel helps to Turbocharge Infotainment Systems Designs
- Making cars safer through technology innovation
- Supplying DC input power for HEV testing
- NSR Noise Suppressors: Wirewound Resistors
- Virtual Hardware “In-the-Loop”: Earlier Testing for Automotive Applications
- Open Standards and Product Differentiation