April 19, 2012 NXP Semiconductors N.V. has made a new addition to its highly successful family of RFCMOS-based one-chip car radio solutions. The TEF664x integrates a low-IF AM/FM tuner and DSP processing all in one chip and is designed for single-tuner applications. Read more

April 5, 2012 NXP Semiconductors N.V. has signed a definitive agreement to acquire the Dutch electronic design and IP company Catena Group which will help NXP to continue to innovate in the automotive analog mixed signal solutions business and in wireless car connectivity. Read more

November 21, 2011 NXP Semiconductors announced medium power transistors in a 2-mm x 2-mm 3-pin leadless DFN package. Offering a unique solution in an ultra-small DFN2020-3 (SOT1061) Surface-Mounted Device (SMD) plastic package, the BC69PA transistor is the first in a family of medium power transistors from NXP available in a miniature form factor - and, according to the vendor, it is the industry's first medium power transistor in this small form factor. Read more

November 15, 2011 NXP Semiconductors has introduced the first member in its latest generation of high-performance proximity contactless reader ICs. The CLRC663 combines robust multi-protocol support with high RF output power and patented groundbreaking low-power card detection technology. Driven by the market needs for higher integration, smaller housings and interoperability, the IC has been designed for use in a wide variety of infrastructure use cases such as banking, eGovernment, transport and mobile payment. Read more

November 14, 2011 NXP Semiconductors N.V. has introduced two new automotive audio amplifiers supporting energy-saving start-stop systems – the TDF8530 and TDF8546. The TDF8530 is an ultra-efficient quad-channel Class-D audio amplifier supporting the 6 V requirement for start-stop vehicles. Read more

July 27, 2011 NXP Semiconductors N. V. has release a new generation of automotive position sensors. The KMA210 incorporates NXP’s latest magnetoresistive sensor chip and a signal conditioning ASIC developed in NXP’s advanced Silicon on Insulator (SOI) ABCD9 process technology. The device is the first of a new magnetic sensor family in a full system-in-package solution that requires no external components. KMA210 is specially designed to improve the overall performance and increase robustness in automotive applications. Read more

July 14, 2011 NXP Semiconductors N.V. has unveiled the company’s next generation of CAN transceivers with the introduction of the dual high-speed (HS) CAN transceiver, TJA1048. Enabling simpler and more efficient in-vehicle networking design, the TJA1048 is a performance and space optimized solution for electronic control units (ECUs) used in safety, comfort and environment-friendly automotive applications that carry more than one HS-CAN communication interface. Read more

April 27, 2011 NXP Semiconductors N.V. has unveiled an extension to its high speed data converter technology portfolio and the next generation of the CGV high speed serial interface announced in 2009. CGVxpress will be used in future NXP ADC and DAC product families. Read more

April 20, 2011 NXP Semiconductors N.V., has founded the Automotive Centre of Excellence (ACE) in Pune in association with the International Institute of Information Technology (I2IT). Located at I2IT Pune Campus, this Center of Excellence will provide infrastructure and collaboration of the Industry and academia. Read more

March 23, 2011 NXP Semiconductors N.V. has introduced a LIN transceiver family with an integrated low-drop voltage regulator in a small 3x3 mm leadless package. The TJA1028 is designed to power an automotive Electronic Control Unit (ECU), integrating the major peripheral functions around the microcontroller of a typical LIN-networked ECU into a single chip. Read more

November 30, 2010 NXP Semiconductors N.V. has unveiled the first MOSFET in the company's NextPower range with a 30 V Power-SO8 MOSFET, which claims the industry's lowest RDSon of 1.4 mOhm at 4.5 V. The new MOSFET, PSMN1R0-30YLC, is optimized for 4.5 V switching applications and is packaged in LFPAK, the industry's toughest Power-SO8 package. Read more

November 26, 2010 The 25th of November marked the conclusion of a three-week Pan-European field trial during which thousands of automated SMS were sent out from three cars as they were driven through sixteen EU countries. The trial was designed to prove that in-vehicle systems are ready for a unified and cross-borders European emergency system. It was initiated by NXP Semiconductors with partners BMW, IBM, Allianz OrtungsServices, Dekra, Deutsche Telekom and automobile clubs Touring, ANBW, AvD, and UAMK. Read more

November 11, 2010 A pan-European field trial of the eCall emergency system which automatically calls emergency operators in the event of a road accident has started today. The European Union has called for mandatory implementation of eCall with all new cars should be fitted with eCall as standard between 2013 and 2015. Read more

April 19, 2010 NXP Semiconductors claims to be the first supplier to launch a full range of automotive power MOSFETs housed in the compact, thermally enhanced Loss Free PAcKage (LFPAK). Read more