December 14, 2011 Communications chip vendor Broadcom Corporation has introduced a broad automotive Ethernet portfolio, engineered to meet the rigorous qualifications and demands of the automotive semiconductor market. Broadcom's BroadR-Reach automotive portfolio delivers high-performance bandwidth of 100Mbps and beyond while dramatically reducing connectivity costs up to 80 % and cabling weight as much as 30 %, the company claims. Read more

December 12, 2011 NXP Semiconductors has announced the industry's first magnetoresistive angle sensor with integrated amplifier IC. The KMZ60 uses AMR technology (AMR: anisotropic magnetoresistive) and is designed as a low cost, high-performance control device for brushless DC motor (BLDC) commutation. NXP expects that this new sensor will drive uptake of BLDC motor-based applications, particularly in the automotive sector. Read more

November 21, 2011 NXP Semiconductors announced medium power transistors in a 2-mm x 2-mm 3-pin leadless DFN package. Offering a unique solution in an ultra-small DFN2020-3 (SOT1061) Surface-Mounted Device (SMD) plastic package, the BC69PA transistor is the first in a family of medium power transistors from NXP available in a miniature form factor - and, according to the vendor, it is the industry's first medium power transistor in this small form factor. Read more

November 15, 2011 NXP Semiconductors has introduced the first member in its latest generation of high-performance proximity contactless reader ICs. The CLRC663 combines robust multi-protocol support with high RF output power and patented groundbreaking low-power card detection technology. Driven by the market needs for higher integration, smaller housings and interoperability, the IC has been designed for use in a wide variety of infrastructure use cases such as banking, eGovernment, transport and mobile payment. Read more

November 14, 2011 Two new FM receiver ICs from NXP enable designers to implement scanning and data functions in car infotainment systems as a background functionality. The devices decode the signals of the Radio Data System (RDS), Radio Broadcast Data System (EBDS) and Traffic Message Channel (TMS) and thus provide sweeping infotainment functionality to the user. Read more

November 14, 2011 NXP Semiconductors N.V. has introduced two new automotive audio amplifiers supporting energy-saving start-stop systems – the TDF8530 and TDF8546. The TDF8530 is an ultra-efficient quad-channel Class-D audio amplifier supporting the 6 V requirement for start-stop vehicles. Read more

November 9, 2011 The trend towards the deployment of Ethernet in for in-vehicle networking (IVN) is gaining further momentum: After recent announcements from chip vendor Freescale and automotive supplier Continental, four technology companies launched the OPEN Special Interest Group aiming at establishing the technology in automotive applications. Read more

November 3, 2011 Belgian inter-university research center Imec and its project partners have launched the project IMOLA (Intelligent light Management for OLED on foil Applications), a project under the EU's 7th framework program for ICT (FP7). The project's goal is to make large-area OLED-based lighting modules with built-in intelligent light management. Target applications include automotive interior lighting Read more

July 27, 2011 NXP Semiconductors N. V. has release a new generation of automotive position sensors. The KMA210 incorporates NXP’s latest magnetoresistive sensor chip and a signal conditioning ASIC developed in NXP’s advanced Silicon on Insulator (SOI) ABCD9 process technology. The device is the first of a new magnetic sensor family in a full system-in-package solution that requires no external components. KMA210 is specially designed to improve the overall performance and increase robustness in automotive applications. Read more

July 14, 2011 NXP Semiconductors N.V. has unveiled the company’s next generation of CAN transceivers with the introduction of the dual high-speed (HS) CAN transceiver, TJA1048. Enabling simpler and more efficient in-vehicle networking design, the TJA1048 is a performance and space optimized solution for electronic control units (ECUs) used in safety, comfort and environment-friendly automotive applications that carry more than one HS-CAN communication interface. Read more

July 8, 2011 In the world of automotive electronics, new usage models call for closer ties between car and IT. The integration of cars into IT applications, in turn, affects the technologies deployed in the vehicles. EETimes Europe discussed the perspectives of car connectivity with Kurt Sievers, Senior Vice President and General Manager of NXP Semiconductors' automotive business unit. Read more

June 22, 2011 Pioneering the market for 'smart' car keys, NXP Semiconductors has announced the availability of a single-chip solution for multifunction car keys – the NCF2970 (KEyLink Lite). Enhancing the functionality of car keys by supporting Near Field Communications (NFC) technology, NXP's KEyLink Lite enables car manufacturers to offer a new driving experience with keys that connect to external NFC-compliant devices, such as mobile phones, tablets and laptops. Read more

May 19, 2011 As part of the Automotive Week 2011 which took place this week in Eindhoven (The Netherlands), chipmaker NXP demoed a car-to-x communications platform based on the company's software-defined multi-standard digital radio platform. Read more

April 27, 2011 NXP Semiconductors N.V. has unveiled an extension to its high speed data converter technology portfolio and the next generation of the CGV high speed serial interface announced in 2009. CGVxpress will be used in future NXP ADC and DAC product families. Read more

April 20, 2011 NXP Semiconductors N.V., has founded the Automotive Centre of Excellence (ACE) in Pune in association with the International Institute of Information Technology (I2IT). Located at I2IT Pune Campus, this Center of Excellence will provide infrastructure and collaboration of the Industry and academia. Read more

April 6, 2011 Chip manufacturer NXP has announced to shift its global automotive sales and marketing headquarters from Hamburg to Shanghai. At the same time, the company launches a new R&D center for automotive-related technologies in this country. Read more

March 23, 2011 NXP Semiconductors N.V. has introduced a LIN transceiver family with an integrated low-drop voltage regulator in a small 3x3 mm leadless package. The TJA1028 is designed to power an automotive Electronic Control Unit (ECU), integrating the major peripheral functions around the microcontroller of a typical LIN-networked ECU into a single chip. Read more

February 17, 2011 Mobile phones will me more tightly integrated into vehicles – this has been the mantra in the industry already for several years. Now chip vendor NXP and automotive electronics supplier Continental have demonstrated how NFC (Near Field Communications) can be used as an enabler for new applications. Read more

December 17, 2010 Car radios frequently face the problem that when the vehicle travels through various geographies, the regional digital radio standards vary as well. The Series SAF356x digital radio coprocessors from NXP help infotainment device designers to solve the problem: The SAF356x support DAB, DAB+, T-DMB and HD Radio. Read more

November 30, 2010 NXP Semiconductors N.V. has unveiled the first MOSFET in the company's NextPower range with a 30 V Power-SO8 MOSFET, which claims the industry's lowest RDSon of 1.4 mOhm at 4.5 V. The new MOSFET, PSMN1R0-30YLC, is optimized for 4.5 V switching applications and is packaged in LFPAK, the industry's toughest Power-SO8 package. Read more

November 26, 2010 The 25th of November marked the conclusion of a three-week Pan-European field trial during which thousands of automated SMS were sent out from three cars as they were driven through sixteen EU countries. The trial was designed to prove that in-vehicle systems are ready for a unified and cross-borders European emergency system. It was initiated by NXP Semiconductors with partners BMW, IBM, Allianz OrtungsServices, Dekra, Deutsche Telekom and automobile clubs Touring, ANBW, AvD, and UAMK. Read more

November 12, 2010 Whenever these days a discussion involves power electronics for cars, you can be almost sure the topic is related to EV or HEV powertrains and/or Lithium-ion batteries. But there are other power topics as well, and one of them even took center stage at two major semiconductor vendors during electronica: Driving LEDs for automotive headlight applications. Read more

November 11, 2010 A pan-European field trial of the eCall emergency system which automatically calls emergency operators in the event of a road accident has started today. The European Union has called for mandatory implementation of eCall with all new cars should be fitted with eCall as standard between 2013 and 2015. Read more

September 14, 2010 IAR's KickStart Kit for NXP LPC11C14 adds a controller area network (CAN) 2.0B-compliant controller complete with on-chip CANopen drivers to the LPC1100 family of Cortex-M0 based microcontrollers. Based on the previously announced IAR KickStart Kit for LPC1114, the new kit has a CAN interface on the evaluation board to support the features of the LPC11C14 device. Read more

September 1, 2010 NXP Semiconductors has launched a new generation of CAN/LIN System Basis Chips (SBCs) for in-vehicle networks. Offering enhanced EMC (Electromagnetic Compatibility) performance, the UJA107xA chips meet the stringent requirements of global car OEMs such as Audi, BMW, Daimler, Ford, Porsche, Renault, Toyota and Volkswagen. Read more

June 24, 2010 NXP Semiconductors announced that its contactless microcontroller IC, Mifare Plus, has been adopted by the Turkish highway card-based automated toll scheme, Kartlı Geçiş Sistemi (KGS). This volume rollout implemented by the Turkish system integrator Aselsan will see NXP supplying over two million Mifare Plus chips annually. Read more

May 13, 2010 Exposure to Chinese automobile makers helped Dutch chip vendor NXP BV (Eindhoven, The Netherlands) take the top position in the global automotive infotainment semiconductor market in an economically difficult 2009, according to market research company iSuppli Corp. (El Segundo, Calif.). Read more

May 12, 2010 A field trial in the Netherlands has shown that electronic traffic management systems can help to significantly reduce traffic congestion and thus CO2 emissions. The trial used GPS data from the vehicles along with map matching algorithms to optimize the driving routes. Read more

April 30, 2010 NXP Germany and AVL Software have joined their forces in the Pollux research project aiming at extending the cruising range of electric vehicles. The research results also could improve the fuel efficiency of conventional cars. Read more

April 29, 2010 Improved electromagnetic compatibility (EMC) and better electrostatic discharge performance than existing devices are the main benefits of NXPs new high-speed CAN bus transceiver TJA1043. In addition, the device exhibits fail-safe features, network diagnostics and wake-up source recognition. The device allows car OEMs to reduce in-car network costs at better performance and reliability, NXP claims. Read more

April 29, 2010 NXP Semiconductors has launched a number of automotive power MOSFETs in the compact, thermally enhanced Loss Free PAcKage (LFPAK). The Q101 qualified LFPAK devices combines NXP's expertise in packaging technology and its experience in TrenchMOS technology to deliver what is believed to be the most reliable Power SO-8 package in the world. LFPAK is optimised for high-density automotive applications with a footprint 46% smaller than that of DPAK whilst offering similar thermal performance. Read more

April 19, 2010 NXP Semiconductors claims to be the first supplier to launch a full range of automotive power MOSFETs housed in the compact, thermally enhanced Loss Free PAcKage (LFPAK). Read more

February 4, 2010 Radio-controlled entry systems are ubiquitous in today's cars, but security remains an issue. Fraunhofer Scientists now for the first time have implemented an asymmetric encryption scheme in a car key. They claim that the hardware required is comparable in price and power requirements to conventional symmetric encryption keys. Read more