December 14, 2011 Renesas Electronics has developed the industry's first 40-nanometer memory intellectual property (IP) for automotive real-time applications. The company plans to commercialize this IP by launching 40nm embedded flash microcontrollers (MCUs) for automotive applications - also as the first vendor offering this technology in a product. Read more

October 18, 2011 Renesas Electronics and its subsidiary Renesas Mobile Corporation have announced a new member of the R-Car series of automotive systems-on-chip (SoCs), the R-Car H1, capable of delivering up to 11,650 Dhrystone MIPS (DMIPS) and ideal for the high-end car navigation market. Read more

October 5, 2011 Along with its subsidiary Renesas Mobile Corporation, semiconductor vendor Renesas Electronics has developed an automotive system-on-chip (SoC) for high-end automotive display systems (graphics cluster, multifunction graphics display) supporting advanced human machine interfaces (HMI). Read more

September 14, 2011 Renesas Electronics Europe has received VDE (the German Association for Electrical, Electronic & Information Technologies) certification for its IEC60335-compliant self-test software for the RX600 and RL78 microcontroller (MCU) families. These self-test CPU software routines developed for the RX600 and RL78 families are compliant with IEC60730-1 regulations and have now been certified by VDE. Read more

September 6, 2011 Renesas Electronics announced the availability of 32 new RL78/F12 16-bit microcontrollers (MCUs) for automotive control applications, including keyless entry, power window control, and mirror control. The new microcontroller is designed as a contribution to reduced system power consumption and higher performance in these applications. Read more

August 26, 2011 Renesas Electronics announced a new member of its R-Car series of automotive systems-on-chip (SoCs), the R-Car E1, offering low power consumption and high system integration targeting the cost-sensitive market of car navigation and multimedia systems including high-end car radios. Read more

June 10, 2011 Designed for demanding automotive, industrial and consumer applications, the Renesas 32-bit SH7734 Microcontroller SuperH microcontroller (MCU) features high-performance graphics and network functionalities. Electronic component distributor MSC Vertriebs GmbH now has launched sales of the device. Read more

June 8, 2011 Renesas Electronics has announced the availability of six new 4th-generation (X4 generation) V850-based S-series microcontrollers (MCUs) aiming at car infotainment systems and networking. The new products include two MCUs from the V850E2/SG4-H group with 100 pins, two MCUs from the V850E2/SJ4-H group with 144 pins and two MCUs from the V850E2/SK4-H group with 176 pins. Read more

May 9, 2011 The software ecosystem for the RL78 microcontroller family, widely used in power-sensitive automotive and industrial applications is growing: RL78 manufacturer Rensas has announced that a new compiler from IAR Systems for the RL78 is available, as well as real-time operating systems (RTOS) from Micrium and CMX Systems. Read more

March 14, 2011 In the booming global market for automotive semiconductors, the cards have been shuffled anew. The pole position is now occupied by Renesas; the long-standing leader Freescale has dramatically fallen behind. Read more

February 16, 2011 The R-Car M1 series of SoCs released by Renesas Electronics represent the integration of the company’s SH-Navi series and EMMA Car series products. These devices have high adoption rates in car infotainment systems, such as dashboard-mounted car navigation systems. The R-Car M1 series of SoCs have been developed for mid-range systems which are expected to become the highest volume segment in the market and include the R-Car M1A and R-Car M1S in its lineup. Read more

January 18, 2011 Renesas Electronics has introduced 32 new N-channel power MOSFETs with voltage tolerances of 40 and 55 V. The new power MOSFETs include the NP75N04YUK device, featuring a compact HSON package with one-half the mounting area of the existing TO-252 package and the ability to handle current flows of up to 75 A. Read more

November 8, 2010 Renesas Electronics has announced its 4th-generation (X4 generation) V850 series of microcontrollers (MCUs) with 74 devices for automotive applications. This consists of four product series: the P-series for chassis and safety applications; D-series for dashboard applications; F-series for body applications; and S-series for car audio systems. Mass production is scheduled to begin in Q2 FY2011． Read more

October 6, 2010 High expectations are connected to LED headlights for vehicles: High energy efficiency, novel design solutions and greatly improved design options. Renesas' μPD168891 LED control chip integrates several core functions for this type of application. Read more

October 4, 2010 Renesas has added a coprocessor to its V850 architecture that brings the V850 microprocessor performance in signal processing applications on par with available dedicated high-end DSPs. The approach to integrate such a coprocessor on chip offers a number of advantages. With the development, Renesas plans to meet demand for high computing power in real-time applications such as factory automation and automotive engine control. Read more

September 9, 2010 Renesas Electronics Corporation has revealed new strategies on its system-on-chip (SoC) business for mobile and multimedia applications, areas that are expected to extend across various fields and help the company to best bring out its strengths. Renesas Electronics' 2nd SoC Business Unit engages in SoC businesses for mobile applications; automotive information systems, and home electronics systems Read more

September 1, 2010 Motor control functions, encoder timer and a number of additional communication interfaces such as USB 2.0, CAN and Ethernet on one chip are offered by the new microcontrollers of the V850ES/Jx3-E product family. The USB 2.0 Host & Function interface, which is additionally provided on some MCUs, enables a simple and efficient data communication. Read more

August 5, 2010 Renesas Electronics has introduced seven new power metal-oxide-semiconductor field-effect-transistor (MOSFET) products equipped in HSON packages for use in automotive electronics control units for applications including direct injection engine management and electric pump motor control. Read more

August 5, 2010 Renesas Electronics has introduced seven new power metal-oxide-semiconductor field-effect-transistor (MOSFET) products equipped in HSON packages for use in automotive electronics control units for applications including direct injection engine management and electric pump motor control. Read more

August 4, 2010 Chip manufacturer Renesas Electronics announced that its high-performance 32-bit RISC (Reduced Instruction Set Computer) SH-2/SH-2A™ core-based microcontrollers (MCUs) now support Microsoft's .NET Micro Framework 4.1. According to Renesas, this enables system developers to bring systems with touch-screen applications to industrial and automotive applications while achieving faster time-to-market. Read more

May 13, 2010 Exposure to Chinese automobile makers helped Dutch chip vendor NXP BV (Eindhoven, The Netherlands) take the top position in the global automotive infotainment semiconductor market in an economically difficult 2009, according to market research company iSuppli Corp. (El Segundo, Calif.). Read more

May 5, 2010 When it released its SH7216 series of 32-bit on-chip flash memory microcontrollers, Renesas Technology completed its offering with a comprehensive SH7216RSK kit for designers to start evaluation right out of the box. The newest addition to the successful 32-bit SuperH RISC family addresses industrial applications such as AC servos, factory automation equipment, building automation, air conditioning, and general purpose networking. Read more

April 19, 2010 Renesas Electronics Europe developed a 4x7mm IO-Link slave solution that includes the manufacturer's All Flash 78K0R 16-bit microcontroller and an ELMOS IO-Link physical layer transceiver. The new solution is equipped with a ball grid array (BGA) package with a pin pitch of 0.5mm in which the balls are arranged in two rows around the edge of the chip, making it easier for system designers to mount the chip on the circuit board. Read more