Cost-optimised LIN controllers enable new applications

March 16, 2016 // By Christoph Hammerschmidt
With the MLX81107/MLX81109 LIN transceivers, Melexis is addressing the demand within the automobile industry for sophisticated LIN-based switches, actuators, drivers, sensor interfaces and LED lighting systems.

The MLX81107 and MLX81109 both incorporate a physical layer LIN transceiver, LIN controller, voltage regulator, 16-bit RISC-based microcontroller, 32kBytes of Flash memory and 20-channel analog-to-digital converter (ADC), as well as possessing 16-bit pulse width modulation (PWM) capabilities. The LIN protocol handler is compliant with LIN 2.0, LIN 2.1 and LIN 2.2, as well as SAE J2602. The ICs have 4 high voltage capable (12V direct) IOs, plus 8 low voltage capable (5V) IOs. Through these interfaces, communication with the vehicle’s LIN infrastructure is facilitated. Every IO can be programmed to control the application components using the built-in Flash memory resource.


The high level of integration exhibited in the MLX81107/9 devices dramatically reduces both the bill of materials (BoM) costs and board space utilization, promises Melexis. The combination of the LIN controller and approved LIN driver together with directly controlled high/low voltage capable IOs means that LIN can be rapidly implemented into a wide variety of different applications. As these ICs are supplied in 5mm x 5mm QFN packages, thermal performance is maximized and board real estate is conserved. To ensure their reliability in challenging automotive environments, an operational temperature range of -40°C to 125°C is supported, with over-temperature shutdown and load dump (40V) protection mechanism included.  


“The MLX81107/9 offering brings a whole new dimension to in-vehicle network infrastructure, enabling a new generation of smart LIN applications to be realized,” states Michael Bender, LIN Product Line Manager at Melexis. “Engineers can benefit from the mix of highly advanced technology, design flexibility and cost effectiveness all fitted inside a single chip solution. The result is a streamlined, commercial-attractive semiconductor platform that facilitates the development of considerably smaller LIN modules with lower price tags.”