Microsemi demos automotive-grade FPGAs

January 11, 2016 // By Christoph Hammerschmidt
At the upcoming CAR-ELE electronics exhibition in Japan, chipmaker Microsemi will show for the first time its automotive-grade field-programmable gate arrays. The IGLOO FPGA family is qualified according to the AEC-Q100 standard. For example, the devices withstand ambient temperatures up to 125°C, making them suitable for critical under-the-hood applications.

These newly qualified devices are positioned as an alternative to ASICs, providing a low power, cost-effective and secure solution for automotive applications including advanced driver assistance systems (ADAS), vehicle-to-vehicle/vehicle-to-everything (V2V/V2X) communication and electric/hybrid engine control units.

“In addition to providing the highest operating temperature, the IGLOO2 1FPGAs also provide the lowest total power in their class, enabling automotive designers to maximize their dynamic power budget in compact and high performance systems to deliver highly differentiated automotive solutions at the lowest total cost of ownership,” said Bruce Weyer, vice president and business unit manager at Microsemi.

The IGLOO2 FPGA devices, which also met industry standard specifications for grade 2 temperature range earlier this year along with the same vendor’s SmartFusion2 system-on-chip (SoC) FPGAs, offer customers single event upset (SEU) immunity from neutron-induced firmware errors, helping them achieve the zero defect rate essential for the automotive industry, as well advanced security features and secure supply chain.

Demand for high reliability in critical applications, ensuring zero-defect and tamper-free applications, continues to grow rapidly in the automotive industry. With an increase in security mandates amongst its customer base, Microsemi is the only vendor offering automotive-grade FPGAs at higher junction temperature, along with best-in-class security in low power and small footprint packages.

“The automotive market for semiconductors is forecast to grow to $32.3 billion in 2016, from $30.3 billion in 2015, an increase of almost 7 percent,” commented Colin Barnden, principal analyst at Semicast Research. “In comparison, we see the market for semiconductors in vehicle connectivity and ADAS growing at more than 20 percent in 2016. Microsemi’s SmartFusion2 and IGLOO2 devices bring world class security features to the automotive industry and will address several challenges such as hacking, malicious tampering and data theft faced by system designers in creating safe and secure systems for the connected automobiles of the future.”

The IGLOO2 FPGAs will be available in March 2016 for mass production, the company said.