Nexperia shrinks power MOSFET package for cars

March 14, 2017 // By Julien Happich
Nexperia, the former Standard Products division of NXP, has developed very compact automotive power MOSFETs in a thermally-enhanced, loss-free package with a footprint shrunk to less than 20% of that of industry standard devices.

The LFPAK33 devices also feature a significantly lower resistance responding to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability. The new package uses a copper clip design to reduce the package resistance and inductance which in turn reduces the RDS(on) and losses of the MOSFET. The resulting package has an ultra-compact footprint of 10.9mm 2, and because no wires or glue is used internally, operating temperatures of up to 175ºC T ­j max are possible. Devices can handle up to 70A, and the extensive product portfolio includes devices that range between 30V to 100V with an RDS(on) as low as 6.3 mΩ.

Visit Nexperia at www.nexperia.com