Telematics systems that monitor on-board sensors and exchange information with the Cloud are becoming increasingly sophisticated to support high-value services including remote vehicle diagnostics, roadside assistance, and Over-The-Air (OTA) software updates. Infotainment features like location-based services and access to personal content and contacts add further benefit for end users. Over 72% of new cars globally will be fitted with factory-installed telematics systems by 2021, according to ABI Research, and there are opportunities for aftermarket systems, as well as OEM and independent telematics service providers.
ST’s Telemaco concept helps maximize consumer access to these advanced connected-driving services through the cost-effective integration of the telematics processor, secure in-car connectivity, and sound boosting in a single chip. Unlike alternative devices, which are typically based on an application processor or a GSM modem with integrated CPU (Central Processing Unit), ST’s latest Telemaco3 chips are tailored for telematics applications and give extra flexibility to choose the connection type, such as 2G, 3G, or 4G. At the same time, the secure interface with the in-vehicle network is enhanced with a hardware cryptographic accelerator, and connectivity extended with Gigabit Ethernet support and the option to host a Wi-Fi module that can be used as an in-car hotspot.
“As the industry’s only purpose-designed telematics and connectivity controllers, our new Telemaco3 chips provide the performance needed to support next-generation connected-driving services and enable automotive OEMs and aftermarket vendors to bring compelling new products to market,” said Antonio Radaelli, Director, Infotainment, Automotive Digital Division, STMicroelectronics.
The Telemaco3 family comprises the STA1175, STA1185, and STA1195 ICs, which provide choices such as various numbers of CAN interfaces and the optional DSP subsystem, enabling users to scale their designs. Devices are sampling now to lead customers, and full production is scheduled for December 2017.
The Telemaco3 family increases performance for telematics and connectivity applications, compared to the previous Telemaco2 generation, by upgrading the execution speed of the power- and area-efficient main processor