In keeping with the ever evolving nature of automotive safety disciplines, both products are ASIL B SEooC(Safety Elements out of Context) ready to assure that advanced reliability requirements are met. They also support future product progression through ROM/firmware changes.
The MLX90366 uses Melexis' innovative Dual Mold Package to enable “No PCB” assemblies to be realized. This concept integrates passive protection components directly into the IC package, thereby improving reliability and lowering bill of materials costs. The MLX90367 is implemented in JEDEC standard SO and TSSOP packages for integration on to conventional PCB assemblies.