Unlike many MOSFET packages of this size, LFPAK33 has been designed from the ground up to be a tough power solution. Incorporating copper clip and solder die attach technologies, the device features a market-leading junction temperature of 175°Celsius. Nine LFPAK33 power MOSFET types are available immediately.
As electronic devices become ever smaller, components need to shrink to fit the available space and MOSFETs are expected to work under extreme thermal and mechanical conditions. Continuously switching many tens of amps at high temperatures can cause solder joint failure or crack the package case, as the device expands at a different rate to the PCB.
LFPAK33 minimizes the risk of this type of damage through its unique construction which allows the exposed SOURCE and GATE pins to “flex” and safely absorb thermally- and mechanically-induced stresses.
LFPAK33 is fully compatible with QFN and DFN3333 packages – both in terms of PCB footprint and automated vision inspection. The PCB footprint has been fully tested for compatibility by Norcott Technologies.
More information about the NXP LFPAK33 power MOSFET portfolio at www.nxp.com/lfpak33